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Contact pads or bond pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, flip chip mounting, or probe needles.
- Jing Li, Evaluation and Improvement of the Robustness of a PCB Pad in a Lead-free Environment, ProQuest, 2007 ISBN 0-549-32110-1.
- Kraig Mitzner, Complete PCB Design Using OrCAD Capture and PCB Editor, Newnes, 2009 ISBN 0-08-094354-3.
- Deborah Lea, Fredirikus Jonck, Christopher Hunt, Solderability Measurements of PCB Pad Finishes and Geometries, National Physical Laboratory, 2001 OCLC 59500348.
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